J P Sercel Associates (JPSA) has launched the IX-6100-MD for scribing and dicing metal layers such as molybdenum, copper, nickel, gold, silver, zinc and their alloys used in the LED manufacturing process.

The IX-6100-MD is equipped with JPSA’s latest proprietary vision and scribe placement technology allowing reduction in die street size and enabling more LED dies per wafer.

The key technology in IX-6100-MD is JPSA’s proprietary beam delivery system that allows the shape of the laser beam to be independently adjusted in two dimensions. This allows for optimisation of laser energy used for cutting and enables a minimal kerf width of 20µm to be achieved while minimising the heat affected zone.

The IX-6100 series of micromachining systems can be equipped with JPSA’s IAP (Integrated Automation Platform) for automated wafer handling in production environments. The IX-6100 is similar to the company’s IX-6600 platform that is the industry-standard tool used for laser lift-off (LLO) of LED devices in an associated manufacturing process.

JPSA will be shipping several IX-6100-MD laser systems in Q3 to a leading LED manufacture in Asia where the systems will be utilised for singulation of high-power LED devices that use the metal substrate to assist in LED heat dissipation.