iLEDm is the only manufacturer that has introduced backlight technique into LED packaging. This technique is called LEM (LED Packaging Module).

Through the COB (Chip On Board) manufacturing process, low power multi chips are placed directly on aluminum board and packaged with a light guide structure and diffuser that may generate 20~30% more light output than other COB packaging. Compared with multi high power LED, iLEDm’s LEM product presents an even lighting and creates no stack image. The patent of the current design has been applied for in Taiwan, China, Japan, America and Europe.

Another advantage for iLEDm’s LEM is its heat dissipation. By using multi low power chips on aluminum board, heat spreads evenly across the surface of the board instead of using high power chips. Heat solution may also be solved more easily by using iLEDm’s product.

iLEDm Photoelectronics Inc is aim to be the best lighting source provider in LED lighting industry. iLEDm provides LEM in long, square and round shapes. Designers may also apply them into different lighting fixtures. For example, desk lamp, light bulb, tunnel lights, ceiling lights, panel lights etc. Other than the standard products mentioned, iLEDm also accepts orders for customerized design which may help improve and develop new lighting fixture.

In LED Lighting Exhibition of Taiwan this year ( June 10-12, 2009), iLEDm received various positive feedbacks from many lighting manufacturers. The company will every comment into consideration and continue to develop innovative products. Moreover, the company will dedicate itself to improving the quality of LED lighting source for each of its clients.