SPIL went into LED packaging market

Currently, Siliconware Precision Industries (SPIL) has been developing wafer-level LED packaging technology, and planed to produce on a large scale in 2011.

Now, SPIL had offered 25W high brightness (HB) LEDs for general lighting for the three American customers. It is possible more customers choose SPIL’ LEDs.

Following the experience in wirebonding packaging, SPIL focused on the HB multi-chips LED packaging market. And the company thought LED packaging didn’t offer high gross margins, but multi-chip packaging had higher profits compared to single-chip packaging.

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