Altatech Semiconductor has released its first product AltaSight LEDMax system to enter into LED inspection market.

According to the company, AltaSight LEDMax improves production yields for LED devices by accurately detecting process-induced defects, including those that can result during MOCVD of epitaxial layers, subsequent patterning processes and final inspection.

Using Altatech’s patented sensor technology that filters out all background noise, the non-contact system generates images of surface imperfections with resolution down to 1 micron and a unique depth-of-focus capability approaching 500 microns.

An integrated review station performs real-time analysis of the gathered inspection data. It can stitch together images from different perspectives, generate 3D renderings and measure defect sizes. All defect-detection results are stored within the system, and can be output to an operator in standard file formats.

The highly flexible design enables AltaSight LEDMax to combine up to three inspection modules, allowing it to be used in volume manufacturing, process development or R&D applications.

In addition, AltaSight LEDMax has the versatility to meet other III-V inspection requirements. It can accommodate sapphire, silicon, SiC and other transparent surface substrates. The system’s high flexibility and reliability extends to its ability to inspect thin and thick wafers as well as significantly bowed substrates.

AltaSight LEDMax can handle four- to eight-inch wafers without any hardware changes, and a field-upgradeable option for handling two-inch substrates will be available in the coming months.

Production units will be shipped to customers in the first quarter of 2012.