Lumentum Holdings Inc. (“Lumentum”), a global leader in photonic solutions, today announced its showcase of technology and product demonstrations designed to meet the accelerating demands of next-generation AI and data center infrastructure at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles. Visit Lumentum booth 1439 and connect with industry experts.

Multiple demonstrations for scale-out and scale-up networking applications are being showcased:

• 1.6T DR4 OSFP Module with 400G Differential EMLs
  The 1.6T DR4 OSFP pluggable transceiver prototype uses four Lumentum 400G differential EML lasers, as a stepping-stone to a future 3.2T module. The module provides 4x400 Gbps data connectivity over single-mode fiber optics and 8x200 Gbps electrical interface on the host side. Its 4x400 Gbps design leverages Lumentum’s advanced components, world-class packaging, and high-volume manufacturing expertise, targeting next generation hyperscale AI data center applications.
• 800 mW Super-High-Power (SHP) Laser
  Lumentum is highlighting its SHP Laser following the successful launch of its 400 mW Ultra-High-Power (UHP) Laser in 2025. The 1310 nm device delivers more than 1.0 W optical power at 25°C and over 800 mW at 50°C, with <100 kHz linewidth and >40 dB SMSR, enabling high-power, high-performance light sources for co-packaged optics (CPO) and other silicon photonics architectures in both direct-detect and coherent-lite applications.
• 16-Channel DWDM UHP Laser
  The company is featuring a 16-channel DWDM laser source, illustrating Lumentum's readiness to support next-generation CPO architectures that require high bandwidth densities while reducing overall fiber count around a host switch or compute ASIC. The DWDM UHP Lasers are demonstrated using two ELSFP modules producing 16 simultaneous channels across a 200 GHz grid centered at 1310nm, delivering optical power of approximately 24 dBm per channel into fiber. The wavelength grid is compliant with the CW-WDM MSA.

Additional demonstrations are being featured for scale-across and telco applications:

Multi-rail Coherent Optical Channel Monitor (C-OCM)
This demonstration showcases three new products:

• Twin C+L band C-OCM;
• C+L band integrated tunable laser assembly (iTLA); and
• Quad integrated C+L band 3x33 Wavelength Selective Switch (WSS) module (proof of concept design).

The C-OCM integrates two C-band and two L-band channels providing 4x the density of currently available modules on the market. These four channels can be scanned concurrently delivering instrument-grade resolution for enhanced diagnostics and performance monitoring capabilities.

The C+L band iTLA significantly enhances the performance of the nano-iTLA. The tunable operating frequency range is expanded by greater than 200% compared to traditional iTLA products, enabling continuous tuning coverage over 12.4 THz in both C-band and L-band optical windows.

The Quad integrated C+L band 3x33 WSS module is targeted for multi-rail terminal WSS applications and is a proof-of-concept design that can be rapidly brought into production.

• Multi-rail Dynamic Gain Equalizer (DGE) with integrated OCM
  The multi-rail DGE with integrated OCMs offers 4x the density of currently available solutions. DGEs are necessary in long-haul DCI scale-across networks to optimize spectral performance over cascaded in-line amplification nodes. The production released version of this product will combine 8 equalizers with 16 channels monitors in an ultra-compact form factor to support equalization and input/output channel monitoring for two fiber pairs (or rails) carrying C and L band data.

“OFC is an important opportunity for us to demonstrate how Lumentum is pushing the boundaries of photonic innovation,” said Rafik Ward, SVP, Chief Strategy Officer and Chief Marketing Officer at Lumentum. “From 400G per lane pluggable modules to ultra-high-power laser sources and advanced coherent monitoring, our portfolio is designed to enable the scale, speed, and efficiency required by next-generation AI and cloud data center infrastructure.”

TrendForce 2026 Infrared Sensing Application Market and Branding Strategies
Release: 01 January 2026
Format: PDF / EXCEL
Language: Traditional Chinese / English
Page: 168