Lumentum Holdings Inc., Astera Labs, Inc., and Corning Incorporated today announced a joint demonstration of PCIe-over-optics connectivity for AI rack-scale architectures at the 2026 OCP Global Summit in San Jose, California. The rack-level demonstration combines an Astera Labs Scorpio Smart Fabric Switch with Lumentum's 1060 nm VCSEL-based optical interconnect platform and Corning multimode fiber connectivity. The demonstration will be available at Astera Labs booth #B34 from October 12-15.

The demonstration will showcase fully operational optical links that use VCSEL transmitters and photodetectors to extend PCIe connectivity within an AI rack. By transporting PCIe over many parallel optical channels, the architecture is designed to help address the reach, cable density, signal integrity, power, and thermal constraints that can limit conventional electrical interconnects as rack-scale AI systems grow.

The optical interconnect uses high-density 1060 nm VCSEL and photodetector arrays implemented with advanced packaging, including two-dimensional arrays with backside lens technology. Built on Lumentum's ultra-high-volume manufacturing platform in 3D sensing for smartphone devices, it is designed to support high bandwidth density, strong signal integrity, and efficient optical connectivity for rack-level AI architectures.

Astera Labs’ Scorpio Smart Fabric Switch provides the switching element for the demonstration, showing how optical connectivity can extend reach within rack-scale AI systems while preserving a PCIe-based architecture.

The proof-of-concept system is designed to demonstrate multiple 32 Gb/s NRZ optical channels over Corning multimode fiber and an error-free PCIe-5 link. The configuration combines a high-density Lumentum optical engine with Astera Labs’ Scorpio Smart Fabric Switch in a rack-representative system arrangement.

“AI infrastructure is pushing optical connectivity closer to the compute system where reach, density, and power represent significant challenges,” said Matt Sysak, Chief Technology Officer, Lumentum. “This demonstration with Astera Labs and Corning shows how Lumentum's 1060 nm VCSEL platform can extend PCIe connectivity and unlock a whole new class of functionality.”

“As AI clusters scale to unprecedented levels, we are breaking the constraints of single rack-level architectures,” said Adit Narasimha, Senior Vice President, Signal Connectivity Group, Astera Labs. “This demonstration shows how VCSEL-based front-end optics are enabled by Astera Labs' Scorpio Smart Fabric Switch and COSMOS link intelligence to deliver lower latency, improve power efficiency, increase bandwidth density, and overcome connectivity bottlenecks across rack-scale AI systems.”

“As optical links move closer to compute devices, fiber connectivity must support increasing density, precision, and scalability,” said Claude Echahamian, Vice President and General Manager, Emerging Businesses and EMEA, Corning Optical Communications. “Corning’s multimode fiber solutions and industry-leading MMC connectivity help enable this demonstration and support the evolution of high-density optical interconnects for AI infrastructure. As AI clusters continue to grow in size and complexity, Corning is committed to developing fiber and connectivity technologies that enable emerging compute networks and smart fabric architectures.”

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