Genesis Photonics Inc. (GPI) has been devoted to developing flip-chip packaging recently. The Taiwanese LED chip manufacturer built a flip-chip package production line in 2013 to strengthen product integration. The investment paid off, as the company turned profits around in 4Q13 and smoothly introduced flip-chip components into the Chinese street light market. The integrated product line boosted profit margins for components. GPI estimates that by 2014, revenue share for flip-chip components will increase to 15 percent. 

GPI has also expanded investments in construction of in-house flip-chip package production line. The company uses the eutectic boning process for packaging, which produces smaller bubbles allowing for even distribution with an application rate of 80 percent. Focused mainly on the high watt and high driver current market, current monthly visibility for flip-chip packaging is 3kk-4kk. 

At the moment, flip-chip package components make up 5-10 percent of GPI’s overall revenue, but is anticipated to reach 15 percent this year. Gross profit in 4Q13 increased to 19.98 percent with injections from good profit margin performance from new products. As production expansion is limited this year, GPI is focused on product portfolio and improvements to profit margin.