Osram Opto Semiconductors is expanding its existing portfolio for flash applications with a product featuring a specially developed chip sized package (CSP). With Ceramos C, Osram is following the trend for miniaturization as the new LED is the smallest yet in its product family. It is ideal for flash applications on smartphones etc., producing perfect illumination for every snapshot.

(Image: Osram Opto Semiconductors)

The new Ceramos generation no longer has the conventional ceramic package and bond wiring of its predecessors. Instead it utilizes a CSP platform (chip sized package) specially developed by Osram Opto Semiconductors. This ensures that the entire chip surface is uniformly illuminated and that there is virtually no loss of light. Also Ceramos C has a smaller footprint: Measuring just 1.4 mm x 1.4 mm x 0.21 mm, it is three times shallower than its predecessor but produces the same brightness despite its smaller package size. This gives designers greater freedom.

The new Ceramos CSP LED (Image: Osram Opto Semiconductors)

Ceramos C is suitable for use in smartphones or tablets that need a compact LED particularly for the front camera, but also for the main flash and for the flashlight function. With a typical color rendering index greater than 80, the LED offers natural colors no matter where it is used. Ceramos C has a luminous flux of 260 lm and a color temperature of 4,500 K.

“With our new Ceramos C, it will be even easier to take great pictures and selfies. The excellent illumination enables even absolute beginners to get fabulous results”, said Fiona Mak, Marketing Manager at Osram Opto Semiconductors. “Despite its small size, Ceramos C is extremely powerful and a real bonus for end customers. Our Ceramos C fits perfectly with the trend for miniaturization because it’s small enough to be easily installed in even the thinnest smartphones and tablets.”