Osram Opto Semiconductors recently began to work with a Polish company XTPL to initiate evaluation of adopting 3D printing technology solutions to address the challenges connected with the manufacture of future generations of lighting elements.

Osram signed an agreement with XTPL on January 21, 2020, to access the possibility of implementing XTPL’s technology in Osram’s production processes for create conductive interconnections for semiconductors. The potential industrial application of the XTPL method in the lighting industry is yet another proof of its platform character which allows it to be used in a number of fast-growing high technology industries.

The technology, according to XTPL, is similar to the solution developed for repairing open defects in displays and the smart glass industry. Osram and XTPL are now collaborate at the proof of concept stage based on previous results.

(Image: XTPL)

The technology of XTPL can add conductive structures on the individual micron scale (1-8 µm) without using electric field, which fully eliminates the risk of damage to the substrate and other electrically active components.