| |   Management | Member Center | Contact Us RSS facebook google+ twitter linkedin mobile web     CN TW EN

Home > Direct Bond Copper
2015-01-22

Remtec Expands Direct Bond Copper Product Offerings

Remtec, the leading manufacturer of substrates and packages using PCTF® (Plated Copper on Thick and Thin Film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities include solid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Continue reading →
FEATURED PRODUCTS
[News] Optimized IR Lasers from ams OSRAM — Ideal for Particularly Demanding 3D Sensor Applications

The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

[News] Nichia's High-power 280nm UV LED Has Been Chosen by Shikoku Kakoki Co., Ltd. for Their Food and Beverage Filling Machines

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE

PRESS RELEASE