2017-05-16

DELO Introduces New Adhesive for the Optoelectronic Industry

DELO has introduced a new adhesive for optoelectronic applications. DELO DUALBOND OB786 is particularly suited for fixing components within seconds while ensuring precision and high strength. After an irradiation time of less than one second, the build-up of adhesion is already significant; after five seconds, the compression shear strength on glass even reaches 18 MPa. The adhesive also ensures good adhesion to other typical optoelectronic substrates such as aluminum, FR4, PPS, or LCP.
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2016-06-01

Crystalplex Releases Cadmium-free Quantum Dot Material for Optoelectronic Applications

Crystalplex, a pioneer in the development of high stability quantum dots, has announced a new development enabling increased brightness and color stability for LCD displays using cadmium-free Sapphire™ quantum dots.
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE