2016-12-09

Hot Picks of the Week Dec. 5-9

The finale of Aixtron’s sale to Grand Chip Investment ended with the Chinese investor dropping the deal after U.S. President Barack Obama prohibited the German equipment maker from transferring key U.S. patents and assets to the acquisitor, due to national security concerns. In brief, Aixtron’s equipment can be used to make GaN wafers that are used in U.S. military applications including Patriot missiles. The German equipment maker is currently considering to sell parts of its business off instead, after the deal with the Chinese investor failed.
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE