Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
The new IR:6 thin-film infrared LED chip technology is available in 850nm, 940nm and new 920nm wavelength options
First IR:6-based products are the OSLON® P1616 and OSLON® Black series, giving customers a drop-in replacement that o... READ
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Display devices have been used for many years as a means of HMI (Human Machine Interface) to connect humans and machines interactively, and their usage are still expanding.
Automotive interiors are no exception to this trend, with an increasing ... READ
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