2017-01-06

Telink Semiconductor’s RF SoC Passes ZigBee 3.0 Certification Tests

Telink Semiconductor, developer of highly integrated low power chips for Internet of Things (IoT) applications, has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK (software development kit) to its customers.
Continue reading
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE