Infineon Technologies has announced the acquisition of Siltectra, a Dresden-based start-up which developed an innovative technology, named Cold Split, for processing crystal material. The company was acquired for EUR 124 million (US$141.38 million). With the acquisition, Infineon aims to adopt Cold Split technology to split silicon carbide (SiC) wafers, doubling the number of chips out of one wafer. “This acquisition will help us expand our excellent portfolio with the new material silicon carbide as well. Our system understanding and our unique know how on thin ...