2019-01-09

ams Teams up with Face++ to Enhance 3D Sensing Technologies

ams announced its cooperation with Face++, a Chinese AI software developer, to accelerate OEMs’ and system integrators’ deployments of 3D optical sensing technologies such as face recognition. According to ams, the partnership with Face++ will enable manufacturers to bring facial recognition and other systems to market faster including functions like facial payments, Animoji creation and augmented/virtual reality. The 3D optical sensing solutions created by ams and Face++ use infrared light projectors to map the surface of real-world objects such as a user’...
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE