2022-05-25

Showa Denko's Program to Develop 8-inch SiC Wafers for Next-generation Green Power Semiconductor Selected for NEDO's Green Innovation Fund Projects

TOKYO, May 24, 2022 - (ACN Newswire) - Showa Denko (SDK) (TOKYO: 4004) proposed its "Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors(1)" (hereinafter "the Project") to New Energy and Industrial Technology Development Organization (NEDO) as a candidate for "Projects to Develop Wafers Technology for Next-generation Power Semiconductors" which was set as a research and development target of "Next-generation Digital Infrastructure Construction(2)" in "Green...
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ViewSonic Corp., a leading global provider of visual solutions, brought its cutting-edge display technologies to 2025 Creative Expo Taiwan, transforming art into immersive visual experiences. The theme for 2025, Water Scapes, celebrated Taiwan&rs... READ MORE

A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE