The glass substrate race is heating up as AI chips demand larger packages, with South Korean and Japanese players racing to gain an early edge. According to Seoul Economic Daily, Japan’s Shinko Electric Industries has developed a 22-layer glass substrate by stacking 11 copper wiring layers on each side, addressing the so-called “SeWaRe” issue of internal cracking or delamination. As explained by the report, the shift toward larger AI packages is exposing the warpage limits of conventional organic substrates. By contrast, glass offers greater rigid...