2026-08-23

[News] ECOC and GPEF 2026: Discover the Future of Optical Interconnects

ECOC: Driving optical interconnect innovation for AI data centers ams OSRAM combines expertise in micro-emitters, micro-photodiodes, CMOS and advanced packaging to enable integrated optical solutions for the next generation of AI infrastructure. At ECOC 2026, we show how our “wide & slow” architecture addresses the rising bandwidth density and reach challenges in AI data centers. Combining ams OSRAM’s groundbreaking micro-array technology with system-level co-optimization, we enable scalable, cost-effective and energy-efficient optical...
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For three decades, white LEDs have depended on rare earth materials such as yttrium aluminum garnet (YAG) layered onto a blue LED chip (Figure 1). Seoul Viosys Co., Ltd. (KOSDAQ: 092190) today announced that it has broken that dependence. It h... READ MORE

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