Moving data efficiently is becoming one of the defining challenges of next-generation AI systems. As AI clusters continue to scale, optical interconnects are emerging as critical technology for enabling higher bandwidth at significantly lower power consumption. Expanding ams OSRAM's Digital Photonics Interconnects platform into AI scale-up through a growing ecosystem of industry partners Introducing next-generation 850nm Thin-Film microVCSEL arrays with addressability enabling highly parallel "wide-and-slow" optical architectures Demonstra...

ams OSRAM wide-and-slow architecture for scale-up, scale-out and future chip-to-chip use cases in AI data centers.<iframe allow="accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share" allowfullscreen="" frameborder="0" height="315" referrerpolicy="strict-origin-when-cross-origin" src="https://www.youtube.com/embed/Q1iY4FfBu9A?si=z-Cz_Rdml6ZOMCMG" title="YouTube video player" width="560"></iframe>Micro-array technology for higher-density AI interconnects Can your datacom architecture keep pace with rising...