| |   Management | Member Center | Contact Us RSS facebook google+ twitter linkedin mobile web     CN TW EN

Home > LED Encapsulation Process
2009-07-24

LED Encapsulation Process

Encapsulation is generally adopted in packaging of lamp-LEDs. The encapsulation procedure is to pour liquid epoxy into the LED moulding chamber first, and then insert the LED bracket that has undergone the press welding, then put the mould into the oven, and the LED gets shaped when the epoxy solidifies. The procedure of encapsulation sounds rather simple, while the following points should be paid attention to:
Continue reading →
Weekly Top7
Monthly Top7
FEATURED PRODUCTS
[News] Optimized IR Lasers from ams OSRAM — Ideal for Particularly Demanding 3D Sensor Applications

The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

[News] Nichia's High-power 280nm UV LED Has Been Chosen by Shikoku Kakoki Co., Ltd. for Their Food and Beverage Filling Machines

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE

PRESS RELEASE