Toshiba Corporation will start sales of white LED packages this month. Production of LED chips is typically done on 2- to 4-inch wafers with an expensive sapphire substrate. Toshiba and Bridgelux have developed a process for manufacturing gallium nitride LEDs on 200mm silicon wafers, which Toshiba has brought to a new production line at Kaga Toshiba Electronics Corporation, a discrete products manufacturing facility in northern Japan. Mass production of packages using the new line's output starts this month. Deployment of Toshiba and Bridgelux's new GaN...