2013-07-12

Dowcorning Introduces OE6662 Encapsulant to Promote the Development of SMD Products

In recent years, LED epitaxy and chip technology, the phosphor preparation and application, and the high thermal conductive stent technology have achieved rapid development, however, there has the following technology and new trends in the field of SMD package: high current drive, high power, medium / large size, high thermal conductivity brackets and higher requirements on lighting quality. For the new trends of LED SMD packaging market, as a global leader in silicones, silicon-based technology and innovation, Dow Corning introduced OE6662 organic silicon encapsulation ...
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ams OSRAM, a global leader in innovative light and sensor solutions today held a roundtable forum spotlighting new opportunities with high precision illumination characterization. The event brought together experts from industry, academia, and... READ MORE

ams OSRAM introduces the new generation of the NIGHT BREAKER LED SPEED H7 and the first NIGHT BREAKER LED SPEED H4 which is another milestone in the field of LED retrofit lamps. Both road-approved¹ retrofit solutions carry the addition up... READ MORE