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2013-09-06

Universal Highlights Advanced Package-on-Package at SEMICON Taiwan

Presentation examines process optimization for wide IO Package-on-Package implementation

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1 Opsys Collaborates with Curiosity Lab and City of Peachtree Corners to Launch Solid-State LiDAR Technology
2 AccuSim launches technical partnership with Bendac for industry-first LED displays
3 OMNIVISION Debuts Industry’s Smallest-Footprint Sensor for Presence Detection, Facial Recognition and Always‑On
4 Vertiberry picks Sollum for strawberries
5 Five Powys schools fitted with solar panels thanks to grant
6 Brightek Unveils RGB ICLED Hardware and Software Integration Solution with Global Debut at electronica 2024 in Munich
7 Where the Future Begins: Samsung Showcases Pioneering Innovations for AI and Automotive Technologies at electronica 2024 in Munich

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Violumas Boosts 275nm and 265nm Output in Next Generation UVC LEDs

Violumas, provider of high-power UV LED solutions and inventor of 3-PAD LED technology, is proud to launch the release of new 275nm and 265nm LEDs in mid-power, high-power, and high-density packages. The radiant flux of the new 275nm and 265nm... READ MORE

Cree LED Introduces CV28D LEDs with Groundbreaking FusionBeam Technology for LED Signs and Displays

DURHAM, NC – November 12, 2024 –– Cree LED, a Penguin Solutions brand (Nasdaq: PENG), today announced the launch of its new CV28D LEDs with FusionBeam™ Technology, a groundbreaking advancement for the LED signage market... READ MORE

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