2013-09-17

Philips Discusses Future Developments in Packaging

The advancement in LED wafer and packaging technology and continual decrease in price is the driver for the upcoming lighting era. Philip SSL Fellow George Craford pointed out that LED packaging component prices have been dropping following the increase in energy efficiency.
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OSP, the Open System Protocol developed by ams OSRAM for dynamic lighting and intelligent vehicle networks, is on its way to becoming an international standard. ISO’s Technical Committee TC 22 (Road Vehicles) has launched standardization... READ MORE

ams OSRAM has entered into an exclusive brand licensing agreement with the Chinese company Ziwooo Biotechnology (Suzhou) Co., Ltd. under the OSRAM brand licensing program. This marks the first collaboration to expand the OSRAM brand into the H... READ MORE