Event Name June 10-12, 2009: Photonics Festival in Taiwan
Region
Location
Dates Jun.10, 2009 ~ Jun.12, 2009
Exhibitors
Visitors
Website

Photonics Festival in Taiwan will be on June 10-12, 2009.

 

Photonics Festival in Taiwan

Expositions

OPTO Taiwan 2009: The 18th International Optoelectronics Exposition

LED Lighting Taiwan 2009: The 5th International LED Lighting Exposition

OPTICS Taiwan 2009: The 3rd International Precision Optics Exposition

SOLAR Taiwan 2009: The 3rd International Solar Exposition

Exhibition Dates

June 10-12, 2009

Opening Hours

10:00am – 5:30pm, June 10-12, 2009

Show Venue

Taipei World Trade Center, Nangang Exhibition Hall, Upper Level (4F)

No. 1, Jingmao 2nd Rd., Taipei, Taiwan

Organizer

PIDA

General information

The most professional and biggest integrated photonics event in Asia.

Admission

Free admission to visit exhibition.

Related Events

Event

Time & Venue

Attendee

Opening Ceremony

10:30am ~ 11:30am
June 11, 2009 (Thu.)

By Invitation

Outstanding Photonics Awards Ceremony

11:00am ~ 11:30am
June 11, 2009 (Thu.)

By Invitation

Welcome Reception

June 11, 2009 (Thu.)

By Invitation

Contact

Photonics Industry & Technology Development Association

Contact : Pamela Hsiao

E-mail : exhibit@mail.pida.org.tw

Tel : 886-2-23514026 ext. 805

Fax : 886-2-23968513

Office : 5F, No.9, Roosevelt Rd., Sec.2, Taipei, Taiwan 100.

For more information please visit: http://www.optotaiwan.com/en/

About LED Lighting Taiwan 2009:

LED Lighting Taiwan 2009 gives you the best insight to the latest development of solid state lighting, see how the lighting technology fused with modern art, architecture and aesthetic design.

Major Exhibits:

1) LED Lighting Fixture

for Indoor, Outdoor, Specialty, Solar

for Decorating, Landscape, Architecture,Garden

Control System & Accessories 

2) LED Applications

Automotive Lamps, Backlight,

Display Board, Traffic Signal, IrDA, etc. 

3) Package / Module

Lamp, Digital, Dot Matrix, Cluster, SMD, etc.  

4) Epi Wafer, Chip 

5) Materials

Substrate, Ingot, Phosphor, Epoxy, Lead Frame, etc. 

6) Processing Equipment

Wafer (MOCVD, Mask, Etching)

Assembly (Dicing, Bonding, Packaging)

Testing (Prober, Aging) 

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