Wafering tool supplier Silicon Genesis (SiGen) has launched its second-generation production system for fabricating thin-silicon solar wafers, as well as HB-LED, and 3D semiconductor packaging wafers.
 
The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials.

The new GenII PolyMax system targets high volumes, aiming to replace wire wafer saws with a kerf-free wafering tool. The system creates thinner wafers than are possible with wire-based slicing. The proton beam-induced wafering design was created over 6 years with numerous equipment and solar cell partners.

SiGen has made free-standing 20um, 50um, 85um, 120um, and 150um of 125mm and 156mm industry standard square kerf-free monocrystalline silicon solar-cell wafers.