TSLC Introduces High Power LED Package for IR Solution

Taiwan Semiconductor Lighting Company (TSLC) is developing packaging based on hybrid technology for wavelengths that range from UV lights with invisible short wavelengths to visible light with long wavelengths of blue, green, red, and IR. Most of the company’s products are packaged on ceramic substrates and they have control over various ceramic substrate layout technology.

Components that use ceramic package technology are highly reliable, have high emission power, and long lifespan. The company’s C3535X-Inx1 product has a radiometric power of 700mW under currents of 1A and WPE of over 30 percent. This can lower system costs while fully displaying CCTV product features at the same time.

Aside from standard packaging components, TSLC also provides customized services to meet client demands for different LED chip array. The company is targeting niche markets with stable profit performances, and emphasizes its core value is to provide clients services they need.

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