U.S. LED manufacturer Cree utilized its monopoly in high power LED chip technology to develop ceramic package LEDs, just shortly after China’s LED package industry ventured into the display backlight market in 2008. Cree went on to dominate the outdoor lighting market and other high end applications, while setting new luminous efficacy records.

SemiLEDs Corporation (Nasdaq:LEDS), a global provider of vertical LED technology solutions, today announced sampling and volume availability of a complete line of 80x80mil rugged metal LED chips, including white, blue, and UV variations. The EV-80mil family allows packagers and integrators a wider variety of high-efficiency/high-output choices to address the growing number of applications in both the commercial lighting and industrial spaces. With the new family, a single 80x80mil device will typically replace four 40x40mil LED chips, which simplifies packaging and optical designs, while minimizing color fringing and shadow effects common to multi-chip implementations. 

Taiwan Semiconductor Lighting Company (TSLC) is developing packaging based on hybrid technology for wavelengths that range from UV lights with invisible short wavelengths to visible light with long wavelengths of blue, green, red, and IR. Most of the company’s products are packaged on ceramic substrates and they have control over various ceramic substrate layout technology.