A team of researchers at Chung-Shan Institute of Science and Technology (CSIST) have developed aluminum nitride (AlN) substrate for high power LED. The project is backed by Taiwan Ministry of Economic Affair’s Technology Innovation Center, according to Taiwanese media source Micro-Electronics on June 20, 2014. 

AlN has advantages over conventional materials, such as aluminum and silicon, due to its good insulation properties and high thermal conductivity. It can resolve heat dissipation problems for LEDs and prolong lifespan by 6,000 to 7,000 hours. The thermal conductivity of the aluminum nitride substrate can reach a high temperature of K-200w/mk, which makes it conducive for use in high powered LEDs. 

Samples of the AlN substrate have already been sent to a Taiwan based ceramic substrate manufacturer where it will be tested for six months. The substrate technology will be transferred and enter mass production and supply Taiwanese LED manufacturers by 2015 earliest. 

CSIST intends to transfer the technology to Taiwanese manufactures to create a local AlN LED supply chain. This will allow the country to independently develop the technology, and drive Taiwanese LED lighting market developments. The institute also projected this could increase Taiwan’s LED technology’s international competitiveness. 

Additional research in phosphor and packaging materials 

CSIST presented their research at Taiwan’s Photonics Festival 2014 last week along with additional research in LED lighting raw materials, phosphor, packaging materials, and more. 

The institute has developed a non-oxidizing technology for synthesizing nitride compounds through a new red 258 nitride phosphor patent. The technology can increase brightness, CRI, and heat resistance. CSIST hopes that the technology will assist local Taiwanese manufacturers by allowing them overcome Japanese manufacturers’ ownership of a majority of phosphor patent. In regards to packaging materials, the institute developed a high heat dissipation thermal paste and thermal resistant low dielectric package resin, which makes LED heat dissipation design easier.