Rohinni Secures Chinese Patent Awards Covering LED Placement Technology

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Claims cover proprietary placement solutions needed in the advanced display market to efficiently utilize miniLED technology

Liberty Lake, Washington – July 25, 2022 – Rohinni, a leading developer of advanced component placement solutions, today announced four new Chinese patent claims related to high-speed placement processes have been awarded. The patents cover the company’s newest placement technology which allows for the placement of semiconductor die at speeds greater than 100Hz with accuracy levels of <10µm. The new patents protect Rohinni’s complete solution that achieves a 33% improvement in placement speed, thus requiring 25% fewer machines to meet the projected 2025 demand with 12.6% lower total cost of ownership than leading competitive technology.

The granted claims provide a wide range of protection including the bondhead and needle transfer device, inspection technology and motion control. The awarded claims address the key pillars of Rohinni’s total solution which will be formally introduced later this year.

“miniLED and microLED technology adoption is accelerating at an incredible pace. Rohinni’s demonstrated leadership in high-speed placement technology continues to set new levels of performance so miniLED and microLED technology can be deployed widely, said Justin Wendt, Rohinni’s CTO. “These granted claims provide the protection we need to clearly expand our footprint and leadership position. Our customers, including BOE, have exclusive access to our technology which places them at the forefront of advanced display panel manufacturing technology.”

BOE Pixey, the joint venture between BOE and Rohinni, has access to the new patents as a licensee of the technology.

For more information about the Rohinni’s patent awards in China please see the information below:

CN 110544666: METHOD FOR SEMICONDUCTOR DEVICE TRANSFER

CN 112020765: METHOD AND APPARATUS FOR DIRECTLY TRANSFERRING A PLURALITY OF SEMICONDUCTOR DEVICES

CN 112292756: MULTI-AXIS MOVEMENT FOR TRANSFER OF SEMICONDUCTOR DEVICES

CN 112005362: METHOD AND APPARATUS TO INCREASE TRANSFER SPEED OF SEMICONDUCTOR DEVICES WITH MICRO-
ADJUSTMENT

 

TrendForce 2022 Mini LED New Backlight Display Trend Analysis
Publication Dates: April 30 and October 31, 2022
Language: Traditional Chinese/English
Format: PDF
Number of Pages: The two publications will total 120–130 pages

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