Kyocera America, Chemical Sales Division, today announced the U.S. introduction of its environmentally-friendly XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver a wider range of benefits and performance characteristics compared to high-lead solders. Kyocera’s lead-free, pressureless Silver Sinter Paste exhibits excellent thermal and electrical performance, plus strong adhesion to bare copper, making it ideal for high-reliability applications in which heat dissipation is crucial — including power semiconductors, automotive modules and high-brightness LEDs.

“High-power devices such as insulated-gate bipolar transistors (IGBTs), LED power sources and automotive modules have hit a performance ceiling due to the limited thermal dissipation offered by traditional power die attach materials,” said Bob Whisler, president of Kyocera America, Inc. “Kyocera’s Silver Sinter Paste is the solution that will help drive technology to the next level by enabling customers to overcome ongoing technical hurdles and maximize package performance.”

Based on nano-silver technology, Kyocera’s Silver Sinter Paste demonstrates a thermal conductivity of more than 200 W/mK, and excellent die-shear adhesion to bare copper and silver- and gold-plated surfaces. Compared to standard solders and electrically conductive die-attach pastes, Kyocera’s Silver Sinter Paste offers more than three times the thermal conductivity. Moreover, through the utilization of a novel resin-dispersion system, the paste shows excellent interface reliability in the most demanding applications.

The semiconductor industry is making every effort to eliminate high-lead solder in its products, where feasible, due to environmental and health concerns. Many semiconductor devices serve essential safety purposes in automotive and industrial applications. Until now, high-lead alloys — which offer a high melting point and thermal conductivity — were considered necessary to guarantee the required level of reliability. By leveraging the unique properties of nano silver, Kyocera’s solution to further enhance semiconductor performance offers a low-temperature, pressureless silver solder option that enhances the performance of high-power semiconductor devices, such as GaN and SiC.

Kyocera is actively engaged in the development of environmentally friendly products and strives to reduce the use of environmentally-harmful materials and processes in the industries it supports.

Kyocera’s XT2773R7 Silver Sinter Paste is manufactured in Kyocera Chemical Corporation’s Kawasaki, Japan factory, and is already in use by customers worldwide. Kyocera’s Silver Sinter Paste is now available to U.S. customers in both sample and bulk delivery options.

Kyocera America, Inc. will be exhibiting at the 2015 IEEE MTT-S International Microwave Symposium (IMS) in Phoenix from May 19-21 in booth #233. Please contact Iris Labadie for more information at 858.614.2592.