ASM AMICRA Unveils Manufacturing Systems Incorporating X-Celeprint’s MTP Technology

News Source: 
ASM AMICRA Microtechnologies GmbH (“ASM AMICRA”) has announced three new manufacturing systems that combine X-Celeprint's Micro-Transfer Printing (MTP) and ASM AMICRA's high precision die bonding technology to introduce the complete system to enable high volume heterogeneous integration of ultra- thin dies onto up to 300mm base wafers.

X-Celeprint's MTP process stacks ultra-thin dies known as 'x-chips', which can be extremely varied[1] and made using very different process nodes and technologies[2], to create virtually monolithic 3D ICs that improve power, performance, area, cost, time-to-market and security for a wide array of applications including high-performance computing, communications, mobile, automotive, industrial, medical, or defense systems.

ASM AMICRA has been perfecting ultra-high precision placement technology for almost 20 years, and has now incorporated X-Celeprint's MTP technology into three different manufacturing systems. These are:

The Nova+ MTP system, which serves high throughput needs with a fully automatic ISO 4 clean room class system using a 50x50mm MTP stamp enabling massively parallel pick-and-place of x-chips. Placement accuracy is +/- 1.5-microns with a 40-second cycle time.

The NANO MTP system, which serves markets such as photonics that require more precise placement accuracy (plus-or-minus 0.3-microns).

The AFC+ MTP system, which serves R&D and low volume manufacturing markets. Placement accuracy is plus-or-minus 1.0-microns with a 50-second cycle time.

X-Celeprint and ASM AMICRA are facilitating the adoption of MTP technology through development support, including design consultation with assistance in optimizing design and processes and prototyping services to ensure successful product launches. An extensive network of suppliers, manufacturers, and researchers are available to support customer project needs, including licensing programs.

“This agreement with X-Celeprint brings revolutionary technology to market for photonics and 3D heterogeneous integration,” said Dr. Johann Weinhändler, Managing Director, ASM AMICRA Microtechnologies GmbH. “MTP technology offers efficient handling of high volumes of large arrays of ultra-thin , brittle dies, as well as the ability to integrate dies from several different source wafers. MTP technology will provide semiconductor manufacturers with a critical, additional 'tool in the toolbox' that supplements conventional and advanced packaging technology.”

“The ultra-high precision capabilities of ASM AMICRA's MTP manufacturing systems for heterogeneous integration of large arrays of ultra-thin x-chips has the potential to be a game-changer for semiconductor manufacturers seeking to extend Moore's Law with 3D IC heterogeneous integration,” said Kyle Benkendorfer, X-Celeprint's CEO. “Enabling chip designers to combine the optimum materials and different process technologies in 3D ICs results in more powerful devices, with higher density, increased functionality, lower cost, higher yield, and faster time to market. ”

[1] X-chips can consist of various combinations of RF and power transistors, hardware assurance features, photonics, sensors, capacitors, inductors, filters, and antennas, just to name a few.

[2] These processes include SOI, GaN, GaAs, InP and SiGe, among others.
 
 

2021 Global LED Video Wall Market Outlook and Price Cost Analysis

Release Date: September 2020 ( [Update] 7th January 2021 / [Supplement] 1st June 2021 )
Language: Traditional Chinese / English
Format: PDF
Page: 202

If you would like to know more details , please contact:

Global Contact:
 
ShenZhen:
Grace Li
E-mail :  Graceli@trendforce.com
Tel : +886-2-8978-6488 ext.916
  Perry Wang
E-mail :  Perrywang@trendforce.cn
Tel : +86-755-82838931 ext.6800
Disclaimers of Warranties
1. The website does not warrant the following:
1.1 The services from the website meets your requirement;
1.2 The accuracy, completeness, or timeliness of the service;
1.3 The accuracy, reliability of conclusions drawn from using the service;
1.4 The accuracy, completeness, or timeliness, or security of any information that you download from the website
2. The services provided by the website is intended for your reference only. The website shall be not be responsible for investment decisions, damages, or other losses resulting from use of the website or the information contained therein<
Proprietary Rights
You may not reproduce, modify, create derivative works from, display, perform, publish, distribute, disseminate, broadcast or circulate to any third party, any materials contained on the services without the express prior written consent of the website or its legal owner.

With up to 2000lm per LED, LUXEON 7070 delivers the power, efficacy and solution cost reductions luminaire manufacturers need   San Jose, CA – August 31, 2021 – More lumens, higher efficacy, and lower system costs are the... READ MORE

 - Osconiq E 2835 CRI 90 (QD) expands ams OSRAM's portfolio of lighting solutions that provide very high quality in a new mid-power LED. - In-house Quantum Dot technology ensures outstanding efficiency values of over 200 lm/W, even at... READ MORE