Jointmicro Unveils Brand New Indirect Time-of-Flight Sensors and Demonstrates System-Level Performance with Lumentum’s 10 Watt Flood Illuminator Modules for Next-Generation 3D Sensing Applications

 
 
 
Fully integrated, backside-illuminated, VGA/HQVGA resolution, time-of-flight (ToF) Sensor IC with high-QE, high demodulation contrast, high dynamic range, and low noise readout
 
November 30, 2021 – Jointmicro Technology Inc. (“Jointmicro”), a leading provider of 3D sensing sensors, announced a system-level demonstration of its new 640x480 and 240x180 pixels resolution indirect time-of-flight (iToF) sensor ICs (JM151A and JM152A) with a 10 W flood illuminator module based on a three-junction VCSEL array provided by Lumentum, a market-leading designer and manufacturer of innovative optical and photonic products.
 
 
3D sensing has been adopted into various smartphone models and in more applications, including smart devices, smart security, smart home, and other AIoT (artificial intelligence of things), which has rapidly become a priming market and high-performance 3D ToF sensor IC is the bottle-neck of the development of 3D sensing systems. To meet the rising demand and development of next-generation 3D sensing systems, Jointmicro released JM151A, JM152A iToF sensors for customers.
 
JM151A and JM152A are 640x480 (VGA) and 240x180 (HQVGA) pixels, respectively. The products allow high-precision, small pixel, high-resolution, and low-power consuming features in one fully integrated chip by using near-infrared (NIR) enhancement and back-side illuminated (BSI) technology, which can be widely applied in a variety of IoT applications.
 
Jointmicro’s new 3D ToF EVK evaluation kit consists of its high-performance iToF sensor IC, a Lumentum 10 W flood illuminator, and SigmaStar’s SAV636 SoC platform and can be used for long-distance ToF system development with deep learning accelerator (DLA) features.
 
“Jointmicro’s iToF sensor IC implements JointMicro owned Pinned Photodiode pixel structure and pixel HDR technology with NIR enhanced BSI process, which allows high QE, high demodulation contrast, high dynamic range, and low noise readout,” said Yeshi Ma, Jointmicro 3D sensing product director. “This 3D ToF EVK announcement with industry-leading suppliers also demonstrates our deep understanding of the system. At the same time, we will also fully support customers in technical support, marketing, etc., and create a very promising 3D sensing market with partners.”
 
“We are excited to support a wide range of new high-volume 3D Sensing applications with our unique high-performance 10 W flood illuminator modules, such as those enabled by Jointmicro’s new iToF sensors,” said Ken Huang, Lumentum Director of Product Line Management, 3D Sensing. “Our proven and scalable manufacturing capability and our new leading edge VCSEL array designs enable us to deliver on the needs of customers at the forefront of next-generation 3D sensing applications.”
 
About the Product
 
Jointmicro newly released, fully integrated ToF CMOS sensor JM151A and JM152A are diagonal 5.6mm (Type 1/3.2”) 640x480 (VGA resolution) and diagonal 2.1mm (Type 1/8.5”) 240x180 (HQVGA resolution), respectively. The sensor adopts Jointmicro’s original Pinned Photodiode pixel structure and pixel HDR technology with NIR enhanced BSI process that allows high QE, up to 60fps frame rate, high demodulation contrast, high dynamic range, and low noise readout.
 
Currently, the new products are full mask tape-out and ready for mass production. Jointmicro also provides a ToF sensor evaluation board (hardware with development software) for customer bring-up easier. In the future, Jointmicro will develop Next-gen iToF products and new direct time-of-flight (dToF) products in parallel to accelerate 3D sensing development.
 
Key Specifications
 
About JointMicro
 
Jointmicro Technology Inc. is a market-leading designer and headquartered in Fujian, an R&D center in Shanghai, Customer support and sales offices in Shenzhen/Taiwan. Jointmicro team comes from international leading semiconductor companies, with strong technical background, rich industry experience, and excellent customer service capabilities.
 
Jointmicro focuses on 3D ToF sensing, BMS, embedded CPU, consuming, and AI-related chip design and is committed to be the world-class design house. The 3D ToF sensor enables advanced techniques and applications, including smartphones, AR/VR, smart homes, smart cities, etc.
 
 
 

2021 Infrared Sensing Market Trend- 3D Sensing, LiDAR, SWIR LED
Release: 01 January 2021 ([Update] 17th May 2021)
Format: PDF
Language: Traditional Chinese / English
Page: 175

 

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