OPROCESSOR INC, incorporated in Boston, Massachusetts in 2018 with research operations in Daejeon, South Korea, today announced a breakthrough in VCSEL-based Photonic Interposer technology that overcomes the GPU–HBM interconnect bottleneck for next-generation AI and high-performance computing systems.

The pioneering work was published in Photonics (MDPI, August 29, 2025) and will be presented at the IEEE Photonics Conference 2025 in Singapore (November 12, 9:30, 2025).

OPROCESSOR's innovation demonstrates, for the first time, the efficient coupling of multimode VCSEL light into non-silicon waveguides (SiON, Si3N4, SiO2) using:

• Prism coupling technology with ultra-low loss (0.44 dB/cm propagation, 0.76 dB coupling)
• Adhesive bonding method enabling scalable packaging
• Polyimide Micro-lens collimating VCSEL light
• WDM filter integration at the prism base for multiplexing
   

These core inventions are protected under U.S. patents (4 granted, 1 pending) and Korean patents (3 granted, 2 pending), all filed under OPROCESSOR INC (U.S.). This robust IP portfolio secures freedom to operate and positions the company for strategic collaboration with global semiconductor leaders.

The global opportunity for photonic interposers is projected to exceed $100 billion, driven by demand in AI, HPC, and data center infrastructure.

• 200 Gb/s per lane, <0.1 mW/Gb/s
• Multi-terabit bandwidth per package
• Compatible with advanced packaging (CoWoS, SoIC) and memory standards (HBM4/5)
   

"This innovation represents a critical step toward commercializing photonic interposers as the next standard platform for computing systems," said Dr. Sahnggi Park, Technology Founder of OPROCESSOR INC and Principal Research Engineer at ETRI. "By integrating photonics at the interposer level, we are opening a path to ultra-efficient AI and HPC architectures."

TrendForce 2025 Infrared Sensing Application Market and Branding Strategies
Release: 01 January 2025
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