The “Micro LED Technology Research Contest” held by LEDinside has received numerous articles providing innovative and practical solutions to enhance the manufacturing of Micro LED during June 6th – September 30th, 2018. LEDinside was very excited to learn all these novel ideas and technologies offered by different institutes and companies from all over the world. Selecting the winning articles was a tough task as most of them have proposed unique perspectives on how to solve the mass transfer issue of Micro LED or improve their yield rate.

After a long discussion with the judges at the Institute of EO Engineering at National Chiao Tung University and the Consortium for Intelligent Micro-Assembly System (CIMS) of the Industrial Technology Research Institute (ITRI), the final winners list has been decided.

Winners List:

First Place:

AIXTRON – AIXTRON’s MOCVD Technology Breakthrough for Micro LED High Volume Manufacturing
Adam R. Boyd, Arthur Beckers, Martin Eickelkamp, Assad Alam, Michael Heuken

Second Place:

Uniqarta – Laser-Enabled Extremely-High Rate Technology forμLED Assembly
Val R. Marinov

Third Place:

Tesoro – Novel In-Process Functional Test Equipment to Enable MicroLED Mass-Production
Francois J. Henley

Honorable Mention:

QMAT – Engineered Substrates for High Efficiency MicroLEDs and Commercialized High Volume Manufacturing Production
Dong Lee and Philip Ong

Thomas Q.Ke – Mass Production Solution of Micro-LED without Mass Transfer
Thomas Q.Ke at Shanghai Fuxun Team

National Chiao Tung University, Hong Kong University of Science and Technology, Southern University of Science and Technology – Quantum Dots Based Full-color Display on MicroLED Technology
Chih-Hao Lin, Chun-Fu Lee, Chien-Chung Lin, Chen-Hsien Chu, Chin-Wei Sher, Zhao-Jun Liu, and Hao-Chung Kuo

The first and second place winners of the contest are each going to receive one piece of 4-inch Micro LED wafer provided by the Consortium for Intelligent Micro-Assembly System (CIMS). Furthermore, LEDinside will publish the awarded research papers following an interview article for the two winners respectively to further illustrate their research and insights on Micro LED development.

The article awarded with the third place will be published on the website of LEDinside, together with an interview article. For Honorable Mention winners, LEDinside will summarize the content of their research and publish them on LEDinside.

It has been an honor for LEDinside to receive all the papers revealing the cutting-edge Micro LED technologies. We would like to invite our readers to stay tuned with us and learn the details of these state-of-the-art developments of Micro LED proposed by worldwide experts from the industry and the academic field.

Prize: Micro LED Wafer from the Consortium of Intelligence Micro-Assembly System (CIMS)

The Consortium of Intelligence Micro-Assembly System of Taiwan’s Industrial Technology Research Institute (ITRI) has revealed the winners’ prizes, two pieces of Micro LED wafers. Several different sizes of the chips were shown on these 4 –inch Micro LED wafers. Two of the smallest chip sizes are 5μm chips with the pitches of 8μm and 10μm chips with the pitches of 13μm.

(Left: 5μm Micro LED chips with the pitches of 8μm; 10μm MIcro LED chips with the pitches of 13μm)