Sensor component maker ams announced its partnership with SmartSens Technology, a Shanghai/Sillicon Valley-based CMOS image sensors maker, to collaborate in the field of Image Sensors.

ams said that this collaboration complements its strategic approach to further broaden its portfolio for all three 3D technologies, including Active Stereo Vision (ASV), Time-of-Flight (ToF) and Structured Light (SL). To quickly meet an expected increasing demand for 3D sensing solutions in mobile devices, the partnership’s initial focus will be on 3D Near Infrared (NIR) sensors for facial recognition and applications requiring a high Quantum Efficiency (QE) in the NIR range (2D and 3D).

(Image: ams)

To speed up the time to market for customers, the companies will collaborate on the development of a 3D ASV reference design to support the planned future launch of a 1.3MP Stacked BSI Global Shutter Image Sensor with state of the art QE up to 40% at 940nm. The reference design will enable high performance depth maps for payment, face recognition and AR/VR applications at a highly competitive total system cost.

“This collaboration with SmartSens in Image Sensors brings customers the benefit of a faster time to market for 3D Active Stereo Vision and Structured Light applications in mobile phones and other devices including IoT applications, based on ams’ industry leading 3D technology and core IP on Voltage-Domain Global Shutter. The collaboration will also help accelerate time to market for exciting new automotive applications such as in-cabin 2D and 3D sensing,” said Stéphane Curral, Executive Vice President for the Division Image Sensor Solutions at ams.