Recently, Shenzhen Jufei Optoelectronics Co., Ltd (Hereinafter referred to as “Jufei”) got authorized on Thermosetting Resin (EMC, SMC, UP) Packaging patent (Patent No: US11810778B2) from the United States Patent and Trademark Office on November 7th, 3023. Packages protected by this patent are not limited to dicing or punching processes and are high-value core foundation patents for thermosetting resin packaging. 

It is worth noting that this patent is one of a series of cases in which Jufei has further laid out its patent technology for thermosetting resin (EMC, SMC, UP) packaging globally via continuation application after it acquired the core patent for thermosetting resin (EMC, SMC, UP) packaging from Showa Denko in December 2020. By obtaining this U.S. patent license, the depth of the global thermosetting resin (EMC, SMC, UP) packaging technology layout is further consolidated. The patented technology can cover the products Jufei is currently researching and mature products that have been put into the market. Especially, it has a wide range of application prospects and outstanding technical advantages in high-power packaging products, lighting products and automotive products.

In order to avoid product infringement and protect Jufei customers from damage, Jufei has been actively acquiring overseas core patents, and the patent strength gap with international LED head enterprises has gradually narrowed. As early as December 2020, Jufei has been transferred from Japan's HITACHI CHEMICAL (now merged with Japan's Showa Denko) to part of the core patent family of LED thermosetting resin (EMC, SMC, UP) packaging. The packages protected by this part of patent family are not limited to dicing or punching processes. And includes 5 core patents covering the United States, South Korea, China’s Mainland and Taiwan region. Jufei also obtained the right to use 13 patents in countries and area like Europe, the United States, Japan, Malaysia, Singapore, China’s Mainland and Taiwan region.

Patent Diagram

Patent Coverage：Lead Frame & Package

HITACHI CHEMICAL is the first company in the industry to realize the commercial application of white EMC thermosetting resin in LED packaging and to carry out a global patent layout. Jufei obtained the most basic core patent rights and use rights of thermosetting resin (EMC, SMC, UP) packaging by acquiring Hitachi Chemical Company's patents. The innovation and stability of the patent rights are very high. The above patents can be applied to Jufei's Top LED products, including backlight and lighting LED packaging devices, as well as vehicle scale LED devices, further consolidating Jufei's global market competitiveness.
 

Shenzhen Jufei Optoelectronics Co., Ltd was founded in 2005 and it is one of the national torch plan key high-tech enterprises, national intellectual property advantage enterprises, a leading enterprise in domestic backlight industry. On March 19, 2012, Shenzhen Jufei was officially listed in Shenzhen Stock Exchange, stock code: 300303.

The company specializes in R&D, manufacturing and marketing of SMD LED devices, Mini/Micro LED devices, optical devices, optical films, invisible light, etc. Products are widely used in mobile phone, pad, computer, TV, electrical appliances and other consumer electronic products, as well as in display, lighting, automotive electronics, optical communication, optical sensing and other fields.

Since its establishment, Jufei has been working tirelessly in innovation, respecting others' intellectual property rights and actively applying for international patents and seeking cooperation with international bench marking enterprises to obtain core intellectual property rights. Jufei is constantly striving to realize its vision: to become a respectable world-class excellent enterprise!