In order to avoid product infringement and protect Jufei customers from damage, Jufei has been actively acquiring overseas core patents, and the patent strength gap with international LED head enterprises has gradually narrowed. As early as December 2020, Jufei has been transferred from Japan's HITACHI CHEMICAL (now merged with Japan's Showa Denko) to part of the core patent family of LED thermosetting resin (EMC, SMC, UP) packaging. The packages protected by this part of patent family are not limited to dicing or punching processes. And includes 5 core patents covering the United States, South Korea, China’s Mainland and Taiwan region. Jufei also obtained the right to use 13 patents in countries and area like Europe, the United States, Japan, Malaysia, Singapore, China’s Mainland and Taiwan region. HITACHI CHEMICAL is the first company in the industry to realize the commercial application of white EMC thermosetting resin in LED packaging and to carry out a global patent layout. Jufei obtained the most basic core patent rights and use rights of thermosetting resin (EMC, SMC, UP) packaging by acquiring Hitachi Chemical Company's patents. The innovation and stability of the patent rights are very high. The above patents can be applied to Jufei's Top LED products, including backlight and lighting LED packaging devices, as well as vehicle scale LED devices, further consolidating Jufei's global market competitiveness.   Recently, Shenzhen Jufei Optoelectronics Co., Ltd (Hereinafter referred to as “Jufei”) got authorized on Thermosetting Resin (EMC, SMC, UP) Packaging patent (Patent No: US11810778B2) from the United States Patent and Trademark Office on November 7th, 3023. Packages protected by this patent are not limited to dicing or punching processes and are high-value core foundation patents for thermosetting resin packaging.  ...