In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry.

To address the pain points of traditional high-power packaging products, Refond has innovatively adopted diamond-based substrate technology, launching a groundbreaking high-power packaging product—Diamond-based Ultra-high Power Density Packaging. This product meets the demand for high-power LEDs in scenarios such as automotive headlights, outdoor high-intensity lighting, and stage lighting, opening up more possibilities for the development and application of high-power LEDs.

01 High Thermal Conductivity, Superior Heat Dissipation Performance
In high-power application scenarios such as automotive headlights, conventional ceramic materials often suffer from severe light decay, shortened lifespan, or even burnout due to poor heat dissipation. Refond has innovatively adopted a diamond-based substrate, with a thermal conductivity of up to 1800W/(m·K), which is 10 times that of ceramic materials. This enables continuous brightness improvement under high power while ensuring the LED chip operates stably at higher power levels.

02 Compact Single-Lamp Size, High Luminous Efficiency
The new product offers a variety of specifications, with the smallest single-lamp size measuring just 5*5mm. It is fully compatible with mainstream market standards, allowing direct replacement of existing solutions, effectively reducing maintenance costs. It meets the requirements of various high-efficiency application scenarios, especially suitable for situations requiring high brightness and long-term illumination, such as streetlights.

03 High Single-Lamp Power, Excellent Optical Performance
In terms of optical performance, Refond has significantly reduced light propagation losses through the innovative design of the diamond-based substrate packaging structure. The single-lamp power can reach 60W, with a luminous flux exceeding 6500lm. The light distribution is brighter and more uniform, delivering outstanding optical performance in scenarios requiring high brightness and uniformity, such as projectors.

04 Advanced Packaging Technology, Higher Reliability
Diamond material has a low thermal expansion coefficient, which reduces thermal stress caused by temperature changes and prevents issues such as cracking or delamination. Refond's diamond-based ultra-high power density packaging utilizes proprietary advanced packaging technology, effectively enhancing the reliability, stability, and lifespan of the device. This characteristic is particularly important in professional lighting scenarios such as stage lighting, ensuring excellent performance even under high-intensity operation.

Innovation Drives the Future
Explore & Infinite
The launch of the new diamond-based ultra-high power density packaging product is undoubtedly a significant breakthrough in the lighting field. It brings a qualitative improvement to current lighting applications and injects new vitality into the development of high-end lighting. It is gradually demonstrating immense potential in applications such as outdoor lighting, automotive lighting, drone lighting, projectors, and stage lighting.

Relying on its innovative breakthroughs in ultra-high power density packaging technology, Refond will continue to drive product upgrades and iterations, further enhancing the competitiveness of its products to meet the market's diverse application demands for high-efficiency, high-performance LED light sources.

TrendForce 2024 Global LED Lighting Market Analysis
Release Date: 01 February 2024 / 31 July 2024
Language: Traditional Chinese / English
Format: PDF and Excel
Page: 90-100 / Semi-Annual