2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
Continue reading

ams OSRAM (SIX: AMS) has reached another important milestone in automotive lighting now that the new OSRAM XLS LR6 LED is ready for series production. This innovative solution enables car manufacturers to create impressive lighting designs wit... READ MORE

New CT sensor modules from ams OSRAM advance the medical imaging technology across the CT market segments. With two new sensor modules, ams OSRAM (SIX: AMS), a global leader in intelligent sensors and emitters, demonstrates its commitment to C... READ MORE