2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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Veeco Instruments Inc. today announced that a global leader in optical communications laser manufacturing placed orders for multiple Lumina® Metal Organic Chemical Vapor Deposition (MOCVD) systems and multiple Spector® Ion Beam Sputter... READ MORE

Clive Davis, the iconic, award-winning record producer known for launching the careers of Whitney Houston, Bruce Springsteen, Janis Joplin, and more, chose Samsung to help transform his Westchester, New York home theater into a world-class cin... READ MORE