2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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Nichia, the world's largest LED/Laser Diode manufacturer and inventor of high-brightness blue and white LEDs, is pleased to announce that it is currently advancing the joint development of an intravascular laser irradiation system with Ill... READ MORE

ams OSRAM, a global leader in innovative light and sensor solutions, will showcase how its latest solutions are powering game-changing applications in nearly every industry at CES 2026 in an invite-only meeting room at the Venetian Expo. Top e... READ MORE