2025-02-24

[News] Breaking Industry Limits | Refond Launches Industry-First Diamond-based Ultra-high Power Density Packaging

In the traditional LED lighting field, heat dissipation has always been a critical factor limiting performance improvement. Especially with the rapid development of LED technology towards high luminous efficiency and high power, high-power LED packaging technology, due to its structural and process complexity, directly affects the performance and lifespan of LEDs. In complex application scenarios, high-power LEDs face issues such as accelerated light decay and reduced stability caused by poor heat dissipation, which have become urgent challenges for the industry. To a...
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Samsung Electronics Singapore demonstrated its ongoing commitment to the future of virtual production in Southeast Asia and Oceania with a showcase of The Wall for Virtual Production (IVC series) in Singapore. Developed in collaboration with A... READ MORE

ams OSRAM, in cooperation with Marelli, has partnered with the Chinese EV manufacturer NIO to integrate ams OSRAM’s advanced EVIYOS™ HD25 intelligent multi-pixel LED solution used in Marelli's h-Digi® microLED modules into ... READ MORE