ECOC: Driving optical interconnect innovation for AI data centers
ams OSRAM combines expertise in micro-emitters, micro-photodiodes, CMOS and advanced packaging to enable integrated optical solutions for the next generation of AI infrastructure.

At ECOC 2026, we show how our “wide & slow” architecture addresses the rising bandwidth density and reach challenges in AI data centers. Combining ams OSRAM’s groundbreaking micro-array technology with system-level co-optimization, we enable scalable, cost-effective and energy-efficient optical interconnects, while giving system architects new flexibility.
Visit us at booth 1281 to meet our experts and discover how ams OSRAM is shaping the future of AI connectivity.

GPEF: Join the conversation on Digital Photonics and AI infrastructure
ams OSRAM is leading the way to transform the role of light - from pure illumination to an intelligent, versatile technology that connects, senses and interacts.

• Keynote
  In his keynote at OPTICA’s Global Photonics Economic Forum 2026, held alongside ECOC, CEO Aldo Kamper will take attendees into the age of smart light, revealing how Digital Photonics is powering the next photonics revolution.

• Panel Discussion
  In addition, M. Ashkan Seyedi, VP & GM Business Line Digital Photonics Interconnect, will participate in the AI Infrastructure panel discussion on September 24, discussing where integrated optical technologies are essential for AI scaling and how hardware constraints can be addressed. 

TrendForce 2026 Micro LED Display and Non-Display Application Market Analysis
Release: 30 September 2026
Format: PDF
Language: Traditional Chinese / English

TrendForce 2026 Infrared Sensing Application Market and Branding Strategies
Release: 01 January 2026
Format: PDF / EXCEL
Language: Traditional Chinese / English
Page: 168