Ennostar Inc., a global leader in optoelectronic semiconductors, is partnering with X-Celeprint Ltd, the European pioneer in Micro-Transfer Printing (MTP) technology, to accelerate the adoption and commercialization of mass transfer technology in silicon photonics.
With proven expertise in high-volume optoelectronics manufacturing and mastery of micro-scale devices such as Micro LEDs, Ennostar brings strong production capabilities to the partnership. X-Celeprint, recognized for its global leadership in MTP for heterogenous integration, contributes cutting-edge technology that will enable efficient, scalable, and production-ready silicon photonics solutions.

“Our focus is to drive innovation in AI optical interconnects, including solutions based on Micro LED, VCSEL, and CW-DFB LD technologies,” said Patrick Fan, Chairman of Ennostar Corporation*. “By combining Ennostar’s advanced manufacturing know-how with X-Celeprint’s world-leading MTP technology, we believe this collaboration will play a pivotal role in the silicon photonics ecosystem. Through heterogeneous integration, we aim to unlock new breakthroughs in both performance and innovation for the next generation of photonic devices.”
Peter Smyth, CEO at X-Celeprint, added, “By working with Ennostar, we are creating a seamless path for companies to accelerate volume production of silicon photonics across multiple industries.”

Under the collaboration, X-Celeprint will provide its MTP technology and support its customers in qualifying their products for MTP while Ennostar will act as a key manufacturing partner, supporting production. Both companies will jointly evaluate market opportunities and strategically engage with third parties to drive the commercialization of advanced photonics solutions.

Ennostar noted that mass transfer technology, previously applied in Micro LED displays, has already reached a level of maturity. With the rise of AI and high-performance computing, the demand for high-speed data transmission in data centers and advanced computing systems is rapidly increasing, driving an urgent need in the optical communication industry for heterogeneous integration and high-density packaging. Compared to traditional processes, MTP offers significantly greater efficiency and precision, making it a key enabler to meet the challenges of next-generation industry upgrades.

“The introduction of MTP can increase transfer speeds by more than 30 times compared with conventional processes while also improving transfer accuracy by 85%” said CN Huang, Vice President of Ennostar’s Advanced Research Center. This represents a significant breakthrough in the integration of semiconductors and optoelectronic components for Co-Packaged Optics (CPO).
Looking ahead, Ennostar will continue to deepen its technology partnerships and expand market opportunities, working closely with ecosystem partners to advance silicon photonics technologies and deliver competitive integrated solutions.

*EPISTAR Corporation will be renamed “Ennostar Corporation” on October 1, 2025.

(Photo credit: Ennostar)

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