Ennostar Inc., a global leader in optoelectronic semiconductors, is partnering with X-Celeprint Ltd, the European pioneer in Micro-Transfer Printing (MTP) technology, to accelerate the adoption and commercialization of mass transfer technology in silicon photonics. With proven expertise in high-volume optoelectronics manufacturing and mastery of micro-scale devices such as Micro LEDs, Ennostar brings strong production capabilities to the partnership. X-Celeprint, recognized for its global leadership in MTP for heterogenous integration, contributes cutting-edge tech...

As SEMICON Taiwan 2025 kicks off this week, the Silicon Photonics Global Summit took the spotlight on September 8, featuring senior executives from global chip giants such as TSMC, NVIDIA, and Broadcom sharing their latest progress. According to Commercial Times, K.C. Hsu, Vice President of Integrated Interconnect & Packaging at TSMC, called 2024 the “awakening year” for silicon photonics and forecast explosive demand growth in the years ahead as the technology matures. Notably, TSMC Director Shih-Fen Huang highlighted the f...

TOKYO--(BUSINESS WIRE)--Using silicon photonics technology for semiconductor optical circuits, OKI (TOKYO: 6703) has successfully developed an ultracompact photonic integrated circuit chip with a broad range of potential applications, including optical fiber sensors, laser vibrometers, and optical biosensors. This makes it possible to achieve ultra-miniaturization and low power consumption similar to LSI (Note 1), as well as dramatically lower costs through mass production of optical sensor modules. Optical sensors are a technology that uses optical fibers and...

Photonic integrated circuits (PICs) are optical microchip systems with optical components utilizing light (or photons) for data transmission instead of electrons, which are the basis of traditional integrated circuits (ICs), also known as electronic integrated circuits (EICs). This fundamental shift from electronic to photonic signals enables data to be transferred at the speed of light, resulting in significantly higher speeds and greater bandwidth compared with EICs, which are limited by the slower movement of electrons. Massless photons can transmit without the same resis...

CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon photonics and speeding industrialization of the technology. PLAT4M, which is funded by a European Commission grant of 10.2 million euros, includes 15 leading European R&D institutes and CMOS companies, key industrial and research organizations in design and packaging, as well as end users in different application fields, to build the complete supply chain.