As an agent of ShinEtsu, TOPCO Scientific Co. Ltd sells LED silicon materials for the Japanese company. It has developed a new type of packaging material to improve LED process with high reliability.
According to TOPCO Scientific, the new material is designed to enhance the customer process yields by gathering CIE and boosting bin-drop rate. Moreover, it features low water absorption and improves heat resistance and durability.
The material is suitable for use in various packaging processes, either for low power or high power products. So far, its testing performance both at home and abroad has received many positive comments.
As for die attach adhesive, with special treatment targeted at push power and heat as well as, the combination of organic and in-organic transparent silicone resin can resist more heat and light than ever and provide higher push value.
