2014-03-03

Flip Chip Propels Tong Hsing Electronics Industry Ceramic Substrate Technology

Large ceramic wafer manufacturer Tong Hsing Electronics Industries’ annual ceramic substrate for LED revenue grew 10 percent. As LED lighting applications mature, the LED industry is optimistic and is rapidly transforming the industry. New designs, materials, and manufacturing processes are being verified. Among these  flip-chip products were continually launched, driving demand for high heat resistance performance. The market anticipates that Tong Hsing will benefit.
Continue reading
Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE