Flip Chip Propels Tong Hsing Electronics Industry Ceramic Substrate Technology

Large ceramic wafer manufacturer Tong Hsing Electronics Industries’ annual ceramic substrate for LED revenue grew 10 percent. As LED lighting applications mature, the LED industry is optimistic and is rapidly transforming the industry. New designs, materials, and manufacturing processes are being verified. Among these flip-chip products were continually launched, driving demand for high heat resistance performance. The market anticipates that Tong Hsing will benefit.

As the LED industry enters the lighting era, it was unsurprising that mid powered LED products and flip-chip products were the highlight of 2013. In the past, all ceramic wafers supplied by Tong Hsing were used in high powered LED products and has been recently used in mid powered products. A large amount of clients use ceramic wafers in mid powered products, said Tong Hsing. Mid powered high density array packaging and increasing proportion of flip-chip products in the market are driving up demand for ceramic wafer heat dissipation, which will benefit the company’s operational performance.

A portion of manufacturing for components is similar to ceramic substrate. Therefore, some component manufactures are optimistic that LED lighting opportunities will cross into the ceramic wafer market. In order to increase value added, Tong Hsing started to provide TVS anti-static protected component packaging services for their clients in 2013 and continued to push the service in 2014. The company also revealed that the company had only provided TVS component packaging for ceramic wafers and not for LED components in the past. They have removed the possibility for providing LED component assembly services for clients in 2014.

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