Dutch R&D institute Holst Centre (set up by imec and TNO) and American ultra-thin ceramics supplier ENrG Inc. have created the first ever ceramic-based, large-area flexible OLED. The device, manufactured on the 20-40 µm thick Thin E-Strate® ceramic substrate, promises a lifetime in excess of 10 years without the formation of blackspots. The ceramic carrier is also easy to handle and capable of withstanding the high temperatures used in display backplane manufacturing and standard sintering processes.

Building on the success of the groundbreaking XLamp® MH family of LEDs, Cree introduces the XLamp MHD-E and MHD-G LEDs, the high-power LEDs that combine the high lumen density and reliability of a ceramic chip-on-board LED with the design and manufacturing advantages of a surface-mount package. Utilizing elements of the Cree SC5 Technology™ Platform, the ceramic XLamp MHD LEDs simplify development, increase design flexibility and improve manufacturing efficiency compared to mid-power LEDs. The MH family enables new designs and significantly lower system costs, all while delivering industry-leading performance.

3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 

Large ceramic wafer manufacturer Tong Hsing Electronics Industries’ annual ceramic substrate for LED revenue grew 10 percent. As LED lighting applications mature, the LED industry is optimistic and is rapidly transforming the industry. New designs, materials, and manufacturing processes are being verified. Among these  flip-chip products were continually launched, driving demand for high heat resistance performance. The market anticipates that Tong Hsing will benefit.