2014-06-03

3M Launches New LED Chip Package Substrate an Alternative to Ceramic

3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 
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Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, today announced wins with Sparrow Quantum (Denmark) and Yeungnam University (South Korea), who have selected Veeco’s Molecula... READ MORE

Cree LED, a Penguin Solutions brand (Nasdaq: PENG), and SANlight GmbH, Schruns, Austria, today announced a partnership under which SANlight will use Cree LED’s J Series® products in its new STIXX-Series luminaires. Developed for appl... READ MORE