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2014-06-03

3M Launches New LED Chip Package Substrate an Alternative to Ceramic

3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 
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