2014-06-17

Honglitronic: Small Sized High Power LED Component Trend Becoming More Evident

The rising trend of smaller high power individual components is becoming increasingly obvious. In theory, demands for smaller components to achieve higher optical density, high power, and good heat dissipation are conflicting. Package technology advancements try to juggle these factors in reality. Honglitronic General Manager Lei Lining believes LED flip chips are the solution to the contradicting properties.
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2014-06-13

Smart Lighting Takes Center Stage Again at GILE 2014

The advent of solid state lighting has launched the lighting industry into the developmental fast lane. As solid state lighting technology evolves and advances, many manufacturers are looking towards intellectualizing lighting systems to meet increasing market demands and secure a sustainable revenue model. 
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2014-06-11

Top Five Trends at Guangzhou International Lighting Exhibition 2014

With only one day left, the Guangzhou International Lighting Exhibition (GILE) 2014 is still going strong with thousands of visitors pouring into the show grounds to view and explore the booths spread out among the two halls.
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ams OSRAM, a global leader in innovative light and sensor solutions today announced at Laser World of Photonics China (LWPC) 2026 a portfolio of laser products powered by its latest blue multi-mode laser chips. The company also presented, for ... READ MORE

The introduction of the new Audi Q3 marks significant technological progress in how digital lighting systems are integrated into the Audi compact segment. EVIYOS HD25 is an advanced, pixel-based lighting solution developed by ams OSRAM. It is ... READ MORE