2014-06-17

Honglitronic: Small Sized High Power LED Component Trend Becoming More Evident

The rising trend of smaller high power individual components is becoming increasingly obvious. In theory, demands for smaller components to achieve higher optical density, high power, and good heat dissipation are conflicting. Package technology advancements try to juggle these factors in reality. Honglitronic General Manager Lei Lining believes LED flip chips are the solution to the contradicting properties.
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2014-06-13

Smart Lighting Takes Center Stage Again at GILE 2014

The advent of solid state lighting has launched the lighting industry into the developmental fast lane. As solid state lighting technology evolves and advances, many manufacturers are looking towards intellectualizing lighting systems to meet increasing market demands and secure a sustainable revenue model. 
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2014-06-11

Top Five Trends at Guangzhou International Lighting Exhibition 2014

With only one day left, the Guangzhou International Lighting Exhibition (GILE) 2014 is still going strong with thousands of visitors pouring into the show grounds to view and explore the booths spread out among the two halls.
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Silanna UV, a global innovator in ultraviolet semiconductor technology, today announced the release of an additional package type: a TO-39 flat window package for its high-performance SF1 series (Far-UVC 235 nm) and SN3 series (Deep-UVC 255 nm) L... READ MORE

Ennostar, a leading vertically integrated optoelectronic semiconductor company, will showcase its latest Micro LED optical communication innovations at Touch Taiwan 2026, in collaboration with AUO Corporation and Tyntek Corporation. In additio... READ MORE