EV Group and Leti completed the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron).

Leti, a research institute of CEA Tech, today announced it has developed a μLED fabrication process to create high-resolution arrays at 10-micron pitch. 

Ivan-Christophe Robin, Strategic Marketing Manager at Leti, spoke to LEDinside recently about the French research institute’s outlook for micro-LEDs in various end-market applications, especially the wearable sector.

CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms. The four-year project, which launched in 2013, aims at building a European-based supply chain in silicon photonics and speeding industrialization of the technology. PLAT4M, which is funded by a European Commission grant of 10.2 million euros, includes 15 leading European R&D institutes and CMOS companies, key industrial and research organizations in design and packaging, as well as end users in different application fields, to build the complete supply chain.

Grenoble, the center of one of Europe’s key microelectronics ecosystems, is hosting SEMICON Europa 2014 Oct. 7-9. This is the first time France has hosted the premier annual event for the European chip industry, which achieved a 7.9 percent market growth during the first semester of 2014, according to WSTS association. SEMI, the global trade organization that organizes the SEMICON gatherings, will alternate SEMICON Europa every other year between Dresden and Grenoble beginning this year.

CEA-Leti and LUCIOM, which develops visible-light communication using light-emitting diodes (LEDs), have launched a project to develop high-data-rate LiFi transceivers. With this technology, LUCIOMexpects to offer in mid-2015 one of the first high-data-rate bidirectional light-fidelity, or LiFi, products that can work with different LED lighting sources, and on mobile devices.